The complexity and performance requirements of today’s semiconductor packages continue to increase while design resources remain static for most organizations—placing a premium on efficiency and productivity. BestPCB IC packaging and multi-board co-design deliver the automation and accuracy to expedite the design process as part of a comprehensive environment that also includes analysis. With complex advanced packages, our customers are faced with power integrity (PI) and signal integrity (SI) issues driven by increasing IC speeds and data transmission rates combined with decreases in power-supply voltages and denser, smaller geometries. Stacked die and packages, higher pin counts, and greater electrical performance constraints are making the physical design of semiconductor packages more complex. To address these issues, you need advanced PI and power-aware SI methodolgies that can be used throughout the design process.
- Analog/RF Circuit Design- through 56 Gbps
- RF Shielding, high speed digital/mixed signal layout techniques
- Supports complex 3D SiP package design
- Advanced support for wirebond, flip-chip, and wafer-level chip-scale packaging
- Supports efficient and chip IP secure distributed co-design for chip/package optimization.
- Supports a full front-to-back physical implementation flow for IC package design
- Determines the best package and substrate options early in the IC design cycle
- Provides comprehensive design rule and electrical constraint-driven layout
- Incorporates design for manufacturing (DFM) methodologies
- Improves design flow with intrinsic support for all industry standards
- Models entire design in 3D with the optional Cadence 3D Design Viewer
